Low Pressure Molding
Seal and protect sensitive electronics with low pressure molding (LPM). This fast, cost-effective encapsulation method fills the cavities of electronic components or assemblies with light-weight polyamide or polyolefin, providing rugged protection from water, dust, debris, vibration, and impact.
LPM Works Well With:
- PCBs
- Connectors
- Switches
- Sensors
- Wire Harnesses
- Cables