Seal and protect sensitive electronics with low pressure molding (LPM). This fast, cost-effective encapsulation method fills the cavities of electronic components or assemblies with light-weight polyamide or polyolefin, providing rugged protection from water, dust, debris, vibration, and impact.
Low Pressure Molding (LPM) is a modified version of traditional injection molding, involving lower pressure settings. This method is ideal for gently encapsulating delicate electronic assemblies.
In the overmolding process, unprotected PCBs and cable assemblies are placed into a precision moldset tool. The cavity is injected with the chosen low-pressure molding material, enveloping the component in the desired shape. This creates a sealed, protected product that’s ready for immediate handling. LPM is a great alternative to epoxy potting, saving time and materials.
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